THE METHOD OF DYNAMIC SEPARATION AND ITS APPLICATION TO QUANTITATIVE THERMAL-ANALYSIS OF MICROELECTRONIC DEVICES BY LASER INTERFEROMETRY AND REFLECTOMETRY

We present an original method for processing experimental data in quan titative thermal analysis by laser interferometry and reflectometry on normally functioning microelectronic devices. This method hinges on t he different temporal behaviours of thermally induced reflectometric a nd interferometric responses of a device under electric excitation. It permits separation of interferometric contributions related to heat d iffusion from those induced 'instantaneously' by the heat source's tem perature variation. A useful result is that, instead of complex non-st ationary modelling, it suffices to perform just stationary modelling o f the separated contributions to derive thermal data of interest, name ly the device's functioning temperature, the material's thermoreflecta nce coefficient and so on. A detailed description of the development o f the proposed method is given for a current-carrying element in an in tegrated circuit.