THE EFFECTS OF DESCALING TREATMENTS ON INTERMETALLIC FORMATION AND THERMOMECHANICAL STABILITY OF AN ELECTROPLATED TIN LEAD LAYER IN A SEMICONDUCTOR LEADFRAME ALLOY/

Authors
CHUNG TY CHO TJ KIM YG
Citation
Ty. Chung et al., THE EFFECTS OF DESCALING TREATMENTS ON INTERMETALLIC FORMATION AND THERMOMECHANICAL STABILITY OF AN ELECTROPLATED TIN LEAD LAYER IN A SEMICONDUCTOR LEADFRAME ALLOY/, Journal of materials science letters, 13(20), 1994, pp. 1465-1468
Citations number
11
Categorie Soggetti
Material Science
Journal title
Journal of materials science letters → ACNP
ISSN journal
02618028
Volume
13
Issue
20
Year of publication
1994
Pages
1465 - 1468
Database
ISI
SICI code
0261-8028(1994)13:20<1465:TEODTO>2.0.ZU;2-L