Re. Lobnig et al., MECHANISM OF ATMOSPHERIC CORROSION OF COPPER IN THE PRESENCE OF SUBMICRON AMMONIUM-SULFATE PARTICLES AT 300 AND 373 K, Journal of the Electrochemical Society, 141(11), 1994, pp. 2935-2941
The corrosion mechanism of copper at 373 and 300 K in the presence of
submicron (NH4)2SO4 particle deposits has been investigated. Several i
n situ techniques have been used to monitor the corrosion process in r
eal time. At and above the critical relative humidity of (NH4)2SO4, di
ssolution of Cu is followed by formation of Cu2O, oxidation of Cu(I) i
on to Cu(II) ions, and precipitation of antlerite [Cu3(SO4)(OH)4], bro
nchantite [Cu4(SO4)(OH)6], or posnjakite [Cu4(SO4)(OH)6. H2O]. The amo
unt of corrosion product formed increases with amount of (NH4)2SO4 par
ticles, relative humidity (RH), and temperature. The in situ technique
s allowed us to confirm and refine the individual steps in the multist
ep mechanism proposed in earlier work.