PHASE-DIAGRAMS OF (GOLD-ANALYSIS(BINARY SOLDER) TERNARY ALLOY SYSTEMSBY SMITH THERMAL)

Authors
HAYES FH CHAO WT ROBINSON JAJ
Citation
Fh. Hayes et al., PHASE-DIAGRAMS OF (GOLD-ANALYSIS(BINARY SOLDER) TERNARY ALLOY SYSTEMSBY SMITH THERMAL), Journal of thermal analysis, 42(4), 1994, pp. 745-758
Citations number
15
Categorie Soggetti
Chemistry Analytical
Journal title
Journal of thermal analysis → ACNP
ISSN journal
03684466
Volume
42
Issue
4
Year of publication
1994
Pages
745 - 758
Database
ISI
SICI code
0368-4466(1994)42:4<745:PO(STA>2.0.ZU;2-Q
Abstract
Application of the Smith thermal analysis method [1] to the experiment al determination of ternary alloy phase diagrams is illustrated by ref erence to a study of the Au-Pb-Bi system. This system, which is of int erest in relation to soft-soldered interconnections in solid state dev ice technology, exhibits a ternary eutectic and several transition per itectic reactions.