Sx. Cheng et al., A TINY HEAT PROBE FOR MEASURING THE THERMAL-CONDUCTIVITIES OF NONRIGID MATERIALS, Measurement science & technology, 5(11), 1994, pp. 1339-1344
An improved tiny heat probe for measuring the thermal conductivities o
f cion-rigid materials has been developed. There have been a number of
modifications suggested to the classical heat probe. In the present h
eat probe, a winding copper wire coated with a thin polyester layer, u
sed as a heating element and a resistance thermometer, is enclosed in
a thin metallic tube which is inserted into the measured medium. A reg
ulation voltage is supplied to the wire. The thermal conductivities of
the measured materials can be obtained from the resistance increase v
alues in the wire over a known time interval. A correction formula for
eliminating the effects of varying power in the heater and a time est
imation for reducing the effects of the thermal constants and size of
the probe are established. Using the heat probe, the thermal conductiv
ities of non-rigid materials, such as fruits, powdered graphite, aqueo
us NaCl solution, distilled water and biotissues were measured with re
lative error less than 3%.