A TINY HEAT PROBE FOR MEASURING THE THERMAL-CONDUCTIVITIES OF NONRIGID MATERIALS

Citation
Sx. Cheng et al., A TINY HEAT PROBE FOR MEASURING THE THERMAL-CONDUCTIVITIES OF NONRIGID MATERIALS, Measurement science & technology, 5(11), 1994, pp. 1339-1344
Citations number
12
Categorie Soggetti
Instument & Instrumentation",Engineering
ISSN journal
09570233
Volume
5
Issue
11
Year of publication
1994
Pages
1339 - 1344
Database
ISI
SICI code
0957-0233(1994)5:11<1339:ATHPFM>2.0.ZU;2-3
Abstract
An improved tiny heat probe for measuring the thermal conductivities o f cion-rigid materials has been developed. There have been a number of modifications suggested to the classical heat probe. In the present h eat probe, a winding copper wire coated with a thin polyester layer, u sed as a heating element and a resistance thermometer, is enclosed in a thin metallic tube which is inserted into the measured medium. A reg ulation voltage is supplied to the wire. The thermal conductivities of the measured materials can be obtained from the resistance increase v alues in the wire over a known time interval. A correction formula for eliminating the effects of varying power in the heater and a time est imation for reducing the effects of the thermal constants and size of the probe are established. Using the heat probe, the thermal conductiv ities of non-rigid materials, such as fruits, powdered graphite, aqueo us NaCl solution, distilled water and biotissues were measured with re lative error less than 3%.