The electrical overstress (EOS) susceptibility of ESD I/O protection s
tructures needs to be investigated to assure overall EOS/ESD reliabili
ty in advanced processes. In this paper, the EOS resistance of 0.6 mu
m nMOS ESD protection structures is analyzed in terms of experimental
data, failure analysis results and, device-level electrothermal simula
tions. Thermally induced EOS failures are explained in terms of physic
al phenomena leading to thermal runaway. Device width and contact-to-g
ate spacing are shown to directly affect the EOS robustness of the pro
tection devices.