NEW HYBRID INTEGRATED LASER DIODE-DRIVERS USING MICROSOLDER BUMP BONDING - SPICE SIMULATION OF HIGH-SPEED MODULATION CHARACTERISTICS

This paper proposes two types of new hybrid integrated laser diode (LD )-drivers that use microsolder bump bonding instead of conventional wi re bonding. In one, an LIB and a driver are flip-chip bonded to each o ther; in the other, an LD and a driver are flip-chip bonded onto a sub strate. Their performances are compared to those of a monolithic LD-dr iver and a conventional hybrid one using wire bonding by a simulation program with integrated circuit emphasis (SPICE) with particular empha sis on high-speed LD modulation. The nonreturn-to-zero (NRZ) eye patte rns modulated at signal speeds up to 30 Gb/s by the new hybrid integra ted LD-drivers were hardly inferior to those by the monolithic LD-driv er, whereas; those by conventional hybrid ones were greatly degraded o ver 10 Gb/s. The new hybrid integrated LD-drivers are a feasible alter native to monolithic ones for high-speed optical transmitters.