Multilayer films of [Co 10 Angstrom/Cu(t)](64) with copper thicknesses
from t=10 to 29 Angstrom annealed for 1 h at temperatures about 350 d
egrees C showed a decrease in sample resistivity at 4.2 K. The giant m
agnetoresistance (GMR) maximums for as-deposited films at t=10 Angstro
m and t=23 Angstrom shifted with annealing. The GMR decreased for t=23
Angstrom but increased for t=19 Angstrom and t=29 Angstrom indicating
a complex behavior with annealing. Similarities with granular films a
re discussed.