INTERDIFFUSION AND GRAIN ISOLATION IN CO CR THIN-FILMS/

Citation
Yc. Feng et al., INTERDIFFUSION AND GRAIN ISOLATION IN CO CR THIN-FILMS/, IEEE transactions on magnetics, 30(6), 1994, pp. 3948-3950
Citations number
17
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
ISSN journal
00189464
Volume
30
Issue
6
Year of publication
1994
Part
1
Pages
3948 - 3950
Database
ISI
SICI code
0018-9464(1994)30:6<3948:IAGIIC>2.0.ZU;2-Z
Abstract
In this work, interdiffusion and grain isolation in Co/Cr films have b een investigated by studying the dependence of the magnetic properties on the substrate preheating temperature as well as on post-deposition annealing processes. By choosing pure Co instead of Co-alloy, the pos sibility of grain isolation caused by the segregation of solute atoms from within the magnetic layer had been eliminated. It is found that b oth post-deposition thermal annealing and substrate preheating can eff ectively increase the isolation of the Co grains.