SIMULATIONS OF POST-FILLING PROCESS CONSIDERING THE COOLING EFFECT OFTHE MOLD COOLING SYSTEM

Authors
CHEN SC CHENG NT
Citation
Sc. Chen et Nt. Cheng, SIMULATIONS OF POST-FILLING PROCESS CONSIDERING THE COOLING EFFECT OFTHE MOLD COOLING SYSTEM, International communications in heat and mass transfer, 18(6), 1991, pp. 833-842
Citations number
23
Journal title
International communications in heat and mass transfer → ACNP
ISSN journal
07351933
Volume
18
Issue
6
Year of publication
1991
Pages
833 - 842
Database
ISI
SICI code
0735-1933(1991)18:6<833:SOPPCT>2.0.ZU;2-X