Ev. Kuvaldina et al., RATE-CONSTANT AND PROBABILITY OF INTERACTION OF ATOMIC OXYGEN WITH POLYIMIDE FILMS, High energy chemistry, 26(5), 1992, pp. 387-390
The etching of polyimide films in the afterglow of oxygen plasmas is s
tudied. The rates of etching product formation and mass loss are measu
red. It is shown that the etching rate is determined only by the densi
ty of O(3P). The temperature variations of the rate and of the rate co
nstant and probability of interaction of O(3P) with the polyimide are
obtained..