HIGH-DENSITY MULTILAYER INTERCONNECT MODULE FABRICATION BY LIFT-OFF TECHNIQUE

Authors
PALLEAU J JOURDAIN D OBERLIN JC ALAIMO M ARGOUD G AUBERT D BEUDON M BOUZID MJ LAVIALE D TEMPLIER F TORRES J
Citation
J. Palleau et al., HIGH-DENSITY MULTILAYER INTERCONNECT MODULE FABRICATION BY LIFT-OFF TECHNIQUE, Journal de physique. III, 3(4), 1993, pp. 793-804
Citations number
6
Journal title
Journal de physique. III → ACNP
ISSN journal
11554320
Volume
3
Issue
4
Year of publication
1993
Pages
793 - 804
Database
ISI
SICI code
1155-4320(1993)3:4<793:HMIMFB>2.0.ZU;2-N
Abstract
We have developed technological processes to assemble interconnect net works for multichip modules (MCM). Copper is used as conductor materia l. A new polymeric material, fully cyclised in solution, is used as di electric. The multi-layered structure is deposited on highly doped sil icon substrate used as ground plane. We present several physical, mech anical and electrical characterizations performed all along the networ k assembling.