Polyepichlorohydrin (PECH) rubbers were found to toughen epoxy resins
based on the diglycidyl ether of bisphenol A (DGEBA) and cured with pi
peridine. The degree of toughening depends on the molecular weight of
the PECH and on the curing temperature. Best toughening was achieved w
ith PECH of the highest nominal molecular weight of 3400 (Hydrin 10 X
2). Hydrin 10 X 1 (nominal molecular weight 1700) did not toughen the
epoxy resin unless bisphenol A was also added, whereas Hydrin 10 X 2 t
oughened it in the absence of bisphenol A. Curing resins containing bi
sphenol A and Hydrin 10 X 1 at 160-degrees-C resulted in a slightly mo
re brittle resin than when cured at 120-degrees-C. In contrast, curing
resins containing Hydrin 10 X 2 at 160-degrees-C gave a significantly
tougher resin than when cured at 120-degrees-C. The effect of PECH ru
bbers on the T(g), modulus, and hot/wet properties is similar to that
of carboxy-terminated butadiene-acrylonitrile rubbers (CTBN). Dynamic
mechanical thermal analysis (DMTA) and scanning electron micrographs (
SEM) of fractured surfaces show that the PECH separates as a discrete
phase during curing.