STRESS EVOLUTION DUE TO ELECTROMIGRATION IN CONFINED METAL LINES

Authors
KORHONEN MA BORGESEN P TU KN LI CY
Citation
Ma. Korhonen et al., STRESS EVOLUTION DUE TO ELECTROMIGRATION IN CONFINED METAL LINES, Journal of applied physics, 73(8), 1993, pp. 3790-3799
Citations number
37
Categorie Soggetti
Physics, Applied
Journal title
Journal of applied physics → ACNP
ISSN journal
00218979
Volume
73
Issue
8
Year of publication
1993
Pages
3790 - 3799
Database
ISI
SICI code
0021-8979(1993)73:8<3790:SEDTEI>2.0.ZU;2-V
Abstract
Electromigration is an important concern in very large scale integrate d circuits. In narrow, confined metal interconnects used at the chip l evel, the electromigration flux is resisted by the evolution of mechan ical stresses in the interconnects. Solutions for the differential equ ation governing the evolution of back stresses are presented for sever al representative cases, and the solutions are discussed in the light of experimental as well as theoretical developments from the literatur e.