Aluminum was deposited by chemical vapor deposition (CVD) on an Al(111
) surface, using trimethylamine alane (TMAA). The precursor dissociate
s on the surface and the products (trimethylamine and hydrogen) desorb
at temperatures in excess of 350 K. Surface topographical changes are
observed during the CVD process by thermal energy atomic helium scatt
ering. Growth at 400 K proceeds by a step-flow mechanism.