CLOSED POROSITY ALUMINOSILICATE FOR ELECTRONIC PACKAGING APPLICATIONS

Citation
Sl. Hietala et al., CLOSED POROSITY ALUMINOSILICATE FOR ELECTRONIC PACKAGING APPLICATIONS, Journal of materials research, 8(5), 1993, pp. 1122-1127
Citations number
18
Categorie Soggetti
Material Science
ISSN journal
08842914
Volume
8
Issue
5
Year of publication
1993
Pages
1122 - 1127
Database
ISI
SICI code
0884-2914(1993)8:5<1122:CPAFEP>2.0.ZU;2-0
Abstract
The electrical properties of sol-gel prepared aluminosilicate films we re investigated for suitability in electronic applications. The alumin osilicate films exhibited apparent closed porosity and a dielectric co nstant as low as almost-equal-to 5 with processing temperatures from 3 73 K to 873 K. The porosity was inaccessible to nitrogen at 77 K, heli um at 293 K, and water vapor at 293 K. Both bulk and thin-film samples were analyzed for hydroxyl and carbon contents to elucidate the relat ive dependence of the measured electrical proper-ties on processing co nditions. Experiments indicate it is possible to vary the porosity in bulk material in ways that should improve electrical properties.