Jh. Daly et al., USE OF THERMALLY STIMULATED DISCHARGE MEASUREMENTS FOR THE INVESTIGATION OF CURE AND CHARACTERIZATION OF THERMOSET-EPOXY RESINS SYSTEMS, Journal of Materials Science, 28(8), 1993, pp. 2028-2034
Thermally stimulated discharge (TSD) measurements have been used to mo
nitor the cure in thermoset resins and this paper attempts a critical
assessment of its application to epoxy resin systems. These studies sh
ow that, whilst the method can be used for monitoring cure, there are
problems concerned with the detailed interpretation of the TSD data. T
he observed TSD peaks are complex and associated with charge migration
coupled with dipolar reorientation. Data for a wide range of systems
and conditions used in cure are discussed.