REPAIR OF ELECTROMIGRATION-INDUCED VOIDS IN ALUMINUM INTERCONNECTION BY CURRENT REVERSAL

Authors
HONG CF TOGO M HOH K
Citation
Cf. Hong et al., REPAIR OF ELECTROMIGRATION-INDUCED VOIDS IN ALUMINUM INTERCONNECTION BY CURRENT REVERSAL, JPN J A P 2, 32(4B), 1993, pp. 624-627
Citations number
4
Categorie Soggetti
Physics, Applied
Journal title
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS → ACNP
Volume
32
Issue
4B
Year of publication
1993
Pages
624 - 627
Database
ISI
SICI code
Abstract
Void generation and resistance increase in aluminum stripe due to elec tromigration under high-density dc current are recovered by reversal o f the direction of the current. Thermal annealing without the applicat ion of high-density current had no effect of void repair. This implies that the void repair is driven by the reverse current with the transp ort of aluminum atoms.