Passivation of the electronic defect states at the SiN(x)/InP interfac
e has been achieved using gaseous H2S treatments of the InP surface. A
l/SiN(x)/InP capacitors, fabricated by depositing silicon nitride film
s on the H2S-treated InP, exhibit good capacitance-voltage (C-V) chara
cteristics. The SiN(x) layer is deposited at 200-degrees-C using an el
ectron cyclotron resonance plasma-enhanced chemical vapor deposition (
ECR-PECVD) technique. A minimum trap density of 3.5 X 10(11) cm-2 eV-1
is estimated using the high-frequency C-V characteristics. These devi
ces appear to be more uniform and reproducible than ammonium/phosphoro
us polysulfide-passivated SiN(x)/InP interfaces.