CRRES MICROELECTRONICS TEST PACKAGE (MEP)

Authors
MULLEN EG RAY KP
Citation
Eg. Mullen et Kp. Ray, CRRES MICROELECTRONICS TEST PACKAGE (MEP), IEEE transactions on nuclear science, 40(2), 1993, pp. 228-232
Citations number
14
Categorie Soggetti
Nuclear Sciences & Tecnology","Engineering, Eletrical & Electronic
Journal title
IEEE transactions on nuclear science → ACNP
ISSN journal
00189499
Volume
40
Issue
2
Year of publication
1993
Pages
228 - 232
Database
ISI
SICI code
0018-9499(1993)40:2<228:CMTP(>2.0.ZU;2-1
Abstract
The Microelectronics Test Package (MEP) flown on board the Combined Re lease and Radiation Effects Satellite (CRRES) contained over 60 device types and approximately 400 total devices which were tested for both single event upset (SEU) and total dose (parametric degradation and an nealing). A description of the experiment, the method of testing devic es, and the structure of data acquisition are presented. Sample flight data are shown. These included SEUs from a GaAs 1 K RAM during the Ma rch 1991 solar flare, and a comparison between passive shielding and a specially designed spot shielding package.