INFLUENCE OF AN ADDITION OF THE OCTAGLYCERIDE OF ALKENYLSUCCINIC ACIDS ON CHEMICAL COPPER PLATING

Authors
ISAEV VV BAKAEV VV PISHIN SV FLEROV VN
Citation
Vv. Isaev et al., INFLUENCE OF AN ADDITION OF THE OCTAGLYCERIDE OF ALKENYLSUCCINIC ACIDS ON CHEMICAL COPPER PLATING, Journal of applied chemistry of the USSR, 65(6), 1992, pp. 1018-1021
Citations number
5
Categorie Soggetti
Chemistry Applied
Journal title
Journal of applied chemistry of the USSR → ACNP
ISSN journal
0021888X
Volume
65
Issue
6
Year of publication
1992
Part
1
Pages
1018 - 1021
Database
ISI
SICI code
0021-888X(1992)65:6<1018:IOAAOT>2.0.ZU;2-Q
Abstract
The effects of an addition of an octaglyceride of alkenylsuccinic acid s (SV-104 P) on the process of chemical copper plating and its individ ual coupled electrochemical reactions - cathodic reduction of copper(I I) ions and anodic oxidation of formaldehyde - were investigated.