The integration of thin film ferroelectrics with silicon processing is
being implemented for various types of devices. The technology is bas
ed on the sputtering or chemical deposition of lead-based perovskites
such as lead zirconate titanate. Factors concerned with the integratio
n of ferroelectric films with semiconductor processing are described.
Major interests in Canada include nonvolatile ferroelectric random acc
ess memories for high-speed digital or long-term analog memory applica
tions, high-density capacitors, electro-optic switches, and a wide ran
ge of sensors and actuators integrated into silicon.