VISCOELASTIC ANALYSIS OF THIN POLYMER-FILMS IN ELECTRONIC PACKAGES

The use of the viscoelastic properties of polymer films in a Finite El ement Method (FEM) analysis has been developed. To check the validity of the analysis, the residual stresses developed in three polymer film s, biphenyldianhydride - phenyldiamine (BPDA-PDA), hexafluorodianhydri de - aminophenoxybiphenylin (HFDA-APBP) an divinylsiloxane - bisbenzoc yclobutene (DVS-BCB) attached to silicon substrates, upon cooling from their curing temperatures, have been calculated The calculated stress es agree well with reported experimental data. Linear elastic analyses have also been included for comparison.