SELF-ASSEMBLY OF 3-DIMENSIONAL MICROSTRUCTURES USING ROTATION BY SURFACE-TENSION FORCES

Citation
Rra. Syms et Em. Yeatman, SELF-ASSEMBLY OF 3-DIMENSIONAL MICROSTRUCTURES USING ROTATION BY SURFACE-TENSION FORCES, Electronics Letters, 29(8), 1993, pp. 662-664
Citations number
4
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
ISSN journal
00135194
Volume
29
Issue
8
Year of publication
1993
Pages
662 - 664
Database
ISI
SICI code
0013-5194(1993)29:8<662:SO3MUR>2.0.ZU;2-3
Abstract
The authors propose that automatic, parallel and self-limiting operati ons can be performed to structures into full three-dimensional geometr ies, using the surface tension forces provided by molten solder to per form out-of-plane rotation of flexible hinges. Analysis is presented w hich indicates that the final angle of rotation can be controlled thro ugh initial solder volume, and that the forces are easily sufficient f or the particular example of silicon micromechanical devices. However, the principle is general and could be applied to other materials.