Silicon nitride deposited by electron-cyclotron resonance has been use
d to fully passivate InAlAs/InGaAs HFETs. The passivation process did
not increase the gate leakage current, and passivated 1 mum HFETs had
a breakdown voltage of 15 V. These results illustrate the potential of
ECR nitride for passivation of InP-based semiconductor devices.