The technology of high-resolution focused ion beams has advanced drama
tically in the past 15 years as focusing systems have evolved from lab
oratory instruments producing minuscule current densities to high curr
ent density tools which have sparked an important new process: direct
micromachining at the micrometer level. This development has been due
primarily to the exploitation of field emission ion sources and in par
ticular the liquid-metal ion source. Originally developed in the early
1960's as a byproduct of the development of electrostatic rocket engi
nes, the liquid-metal ion source was adapted for focused beam work in
the late 1970's, when it was demonstrated that submicrometer focused i
on beams could be produced with current densities greater than 1 A cm-
2. Ions can be produced with liquid-metal ion sources from elements in
cluding Al, As, Au, B, Be, Bi, Cs, Cu, Ga, Ge, Fe, In, Li, P, Pb, Pd,
Si, Sn, and Zn. In the past decade, focused ion beam systems with liqu
id-metal ion sources have had a significant impact on the semiconducto
r industry as they were applied to new and greatly improved methods of
failure analysis, as well as circuit repair and modification, in situ
processing, and lithographic mask repair. This article discusses fiel
d emission ion sources, high-resolution ion focusing systems, and mean
s for analyzing their performance. A number of technologically interes
ting and useful applications are also discussed.