VACUUM TIGHT LASER WELDS FOR HERMETICAL INCAPSULATION OF ELECTRONIC PARTS

Authors
SPRUK S JENKO M KOLLER L RAILIC D
Citation
S. Spruk et al., VACUUM TIGHT LASER WELDS FOR HERMETICAL INCAPSULATION OF ELECTRONIC PARTS, Vacuum, 44(5-7), 1993, pp. 461-463
Citations number
9
Categorie Soggetti
Physics, Applied
Journal title
Vacuum → ACNP
ISSN journal
0042207X
Volume
44
Issue
5-7
Year of publication
1993
Pages
461 - 463
Database
ISI
SICI code
0042-207X(1993)44:5-7<461:VTLWFH>2.0.ZU;2-7
Abstract
Our investigations deal with vacuum tight laser welds of welding pairs : soft magnetic iron Vacofer S2 protected with nickel, galvanic plate d to a thickness of 4 mum, and gold, galvanic plated to a thickness of 0.2 mum-CuNi30Fe alloy thickness of 0.25 mm ; its geometry, microstru cture and tightness. The thermal expansion influence on compression gl ass-to-metal seals during the process of laser welding has been estima ted too.