Electrodeposition process of copper under a laser beam has been studie
d by rotating disk electrode. A laser beam results local temperature r
ise at electrode-solution interface, thi leads to: local positive shif
t of rest potential, increase in exchange current i0 and charge transf
er coefficient alpha, strong microstirring which raises limiting curre
nt density. All these changes enhance electrodeposition rates, thus hi
gh-speed selective electroplating can be reached.