A STUDY OF LASER-ENHANCED ELECTRODEPOSITI ON PROCESS OF COPPER

Citation
Xh. Wang et al., A STUDY OF LASER-ENHANCED ELECTRODEPOSITI ON PROCESS OF COPPER, Huaxue xuebao, 51(4), 1993, pp. 341-345
Citations number
5
Categorie Soggetti
Chemistry
Journal title
ISSN journal
05677351
Volume
51
Issue
4
Year of publication
1993
Pages
341 - 345
Database
ISI
SICI code
0567-7351(1993)51:4<341:ASOLEO>2.0.ZU;2-4
Abstract
Electrodeposition process of copper under a laser beam has been studie d by rotating disk electrode. A laser beam results local temperature r ise at electrode-solution interface, thi leads to: local positive shif t of rest potential, increase in exchange current i0 and charge transf er coefficient alpha, strong microstirring which raises limiting curre nt density. All these changes enhance electrodeposition rates, thus hi gh-speed selective electroplating can be reached.