MEASUREMENT OF THE ADHESION AND REMOVAL FORCES OF SUBMICROMETER PARTICLES ON SILICON SUBSTRATES

Authors
BUSNAINA A TAYLOR J KASHKOUSH I
Citation
A. Busnaina et al., MEASUREMENT OF THE ADHESION AND REMOVAL FORCES OF SUBMICROMETER PARTICLES ON SILICON SUBSTRATES, Journal of adhesion science and technology, 7(5), 1993, pp. 441-455
Citations number
37
Categorie Soggetti
Engineering, Chemical","Material Science",Mechanics
Journal title
Journal of adhesion science and technology → ACNP
ISSN journal
01694243
Volume
7
Issue
5
Year of publication
1993
Pages
441 - 455
Database
ISI
SICI code
0169-4243(1993)7:5<441:MOTAAR>2.0.ZU;2-Y
Abstract
In this study, the magnitude of the applied removal force and its rela tionship to the theoretical adhesion force is determined. The removal is done through the application of known hydrodynamic drag and lift fo rces on submicrometer particles. The hydrodynamic removal forces are t hen correlated with the removal percentage and the adhesion forces. A useful correlation that can be used to determine the adhesion force fr om the known applied removal force and the removal percentage is prese nted. Below 90% removal, the data indicate a linear relationship betwe en the removal force and the removal percentage. The effects of time o n the adhesion force and particle deformation are also presented.