Diamond films are of special interest for passivation, because of thei
r chemical stability and electric characteristics. However, the proble
m of about crystal surface distortion on film deposition is crucial fo
r microelectronics applications. An X-ray study of radiation defects c
reated in the silicon subsurface region during ion plasma etching and
covering the crystal with diamond-like carbon films has been carried o
ut. The distorted layer thickness (several nanometres) has been determ
ined to be close to the ion penetration depth and the main radiation d
efects near the crystal surface tum out to be interstitial like. It ha
s been found that the silicon crystal surface under the diamond-like f
ilm, deposited by magnetron sputtering of graphite in argon at the opt
imal bias voltage equal to -100 V, is very smooth on an atomic scale (
the damaged layer thickness was equal to 3.7 angstrom).