NONPOLYMER NEW ORGANIC FILM FOR LOCAL INSULATION IN LASER-DIRECT-WRITING CIRCUIT RESTRUCTURING FOR LARGE-SCALE INTEGRATED-CIRCUITS

A new nonpolymer organic material, hexaacetate p-methylcalix [6] arene (hereafter referred to as MC6AOAc), has been successfully applied to the localized insulator for large-scale integration (LSI) circuit rest ructuring. A conductive line, necessary for the restructuring, was wri tten on the MC6AOAc film by laser chemical vapor deposition with no da mage to the film. The leakage current through the film was kept within the permissible limit. The unnecessary part of the film for LSI testi ng was easily removed by an ethanol rinse without damage to the interc onnection, in a self-aligned manner, with the written line as a mask. This technology extends the usability of the LSI circuit restructuring .