This paper demonstrates that defect control is greatly improved when u
sing the protected environment of a vertical reactor cluster tool comp
rising a preclean station. The cluster tool investigated combines the
established process stability of vertical reactors with new capabiliti
es as native oxide removal, ultraclean wafer transport, and reactors s
hielded from environmental contamination. An adequate combination of c
lean gas usage and leak tightness makes it possible to apply HF vapor
etching effectively in order to control the properties of the silicon-
silicon oxide interface. For different precleaning conditions, interfa
ce and bulk contamination was measured, the sources identified, and th
e effect of improvements monitored. To this end, several electrical pa
rameters were determined, including the analysis of Q(bd) and E(bd). Q
uantitative TXRF and SIMS techniques were used to correlate the result
s with metallic and organic contamination.