B. Hollander et al., FORMATION OF RELAXED SI1-XGEX LAYERS ON SIMOX BY HIGH-DOSE GE-74 ION-IMPLANTATION, Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms, 80-1, 1993, pp. 777-780
High dose Ge-74 ion implantation into the Si surface layer of SIMOX st
ructures has been employed to form strain-relieved Si1-xGex layers on
buried, amorphous SiO2. The samples were investigated by Rutherford ba
ckscattering spectrometry, He+ ion channeling and transmission electro
n microscopy. Ion implantation with an energy of 100 keV and a dose of
3 x 10(17) cm-2 at elevated substrate temperatures followed by rapid
thermal annealing at 1290-degrees-C resulted in a single crystalline S
i0.74Ge0.26 layer with a thickness of 1700 angstrom. The Ge concentrat
ion x of the newly formed Si1-xGex layer can be chosen by using an app
ropriate implantation dose. Strain measurements by ion channeling conf
irmed complete strain relaxation of the Si1-xGex layer after annealing
.