Cj. Mchargue et Jm. Williams, ION-IMPLANTATION EFFECTS IN SILICON-CARBIDE, Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms, 80-1, 1993, pp. 889-894
Results from a program, which has existed for some years, on ion impla
ntation effects in alpha and beta silicon carbide will be summarized.
Silicon carbide is easily amorphized by ion implantation at room tempe
rature. Amorphization as determined by Rutherford backscattering spect
rometry (RBS) occurs for damage energies of about 20 eV/atom, correspo
nding to 0.2 to 0.3 displacements per atom (dpa), at room temperature.
Implantation at higher temperatures ( almost-equal-to 500-degrees-C o
r above) does not produce an amorphous region for damage levels as hig
h as 17 dpa. Recovery of damage at the subamorphous damage level is fa
irly complete by 1000-degrees-C. Epitaxial regrowth after amorphizatio
n occurs over a very narrow temperature range at almost-equal-to 1500-
degrees-C in an almost ''explosive fashion. Damage and amorphization a
re accompanied by swelling of up to 15%. The hardness and elastic modu
lus values of amorphous SiC are 40 and 70%, respectively, of the unimp
lanted single crystalline values, but before amorphization, the hardne
ss first increases during the early damage phase and then decreases up
on amorphization. The oxidation and chemical etching rates of the amor
phous state are higher than for crystalline material. Amorphization ki
netics, annealing kinetics and property changes are broadly compatible
with the idea of a critical accumulation model for amorphization.