THERMAL-BEHAVIOR OF 4-MALEIMIDOPHENYL GLYCIDYL ETHER RESINS

A novel epoxy-maleimide resin 4-maleimidophenyl glycidyl ether (MGE), was prepared from 4-aminophenol. Characterization was carried out by e stimation of the epoxy equivalent and by IR and H-1-NMR spectroscopy. The MGE resin was cured by heating above 250-degrees-C. A decrease in the curing temperature was observed after the addition of a stoichiome tric or non-stoichiometric amount of an aromatic diamine. The values o f the curing temperature and the heat of the polymerization reaction ( DELTAH) were independent of diamine concentration but depended on the structure of the diamine. The char yield of the cured resins at 800-de grees-C in a nitrogen atmosphere ranged from 25% to 40%, which is much higher than the values reported for epoxy resins.