A NEW TIME-TEMPERATURE TRANSFORMATION CURE DIAGRAM FOR THERMOSET THERMOPLASTIC BLEND - TETRAFUNCTIONAL EPOXY POLY(ETHER SULFONE)
Citation
Bs. Kim et al., A NEW TIME-TEMPERATURE TRANSFORMATION CURE DIAGRAM FOR THERMOSET THERMOPLASTIC BLEND - TETRAFUNCTIONAL EPOXY POLY(ETHER SULFONE), Polymer, 34(13), 1993, pp. 2809-2815
Categorie Soggetti
Polymer Sciences
SICI code
0032-3861(1993)34:13<2809:ANTTCD>2.0.ZU;2-D
Abstract
For the cure process of a thermoset/thermoplastic blend, tetrafunction
al epoxy resin/poly(ether sulfone)/dicyandiamide (100/25/5), we establ
ished a new time-temperature-transformation (TTT) cure diagram. The tr
ansformation here involves (1) onset of phase separation, (2) gelation
, (3) fixation of the dimension of phase-separated structure, (4) end
of phase separation and (5) vitrification. The onset and end of phase
separation were characterized by the time variation of the invariant o
f light scattering (V(v)) and the spatial fixation of phase-separated
structure was by levelling off the decrease of scattering peak angle.
The gelation and vitrification points were determined conventionally b
y rheological measurements, i.e. by a cross-over of dynamic storage mo
dulus and dynamic loss modulus curves, and by torsional braid analysis
curve, respectively. The epoxy/poly(ether sulfone) mixture was shown
to exhibit lower critical solution temperature (LCST)-type phase behav
iour (LCST = 265-degrees-C). In the early stage of curing, the ternary
system was at a single-phase regime. After an induction period, phase
separation started by the spinodal decomposition mode, then the domai
n spacing increased with time, i.e. the structure grew self-similarly.
When the system was gelled, the spacing simultaneously ceased to incr
ease. Even after that, the invariant still continued to increase, impl
ying further growth in concentration fluctuation. The invariant then l
evelled off and finally the whole system was vitrified by the increase
in glass transition temperature of the epoxy-rich phase. This situati
on was described in terms of the new TTT cure diagram in wide ranges o
f cure temperature (130-250-degrees-C) and cure time (6 h).