FABRICATION OF NICKEL MICROMECHANICAL STRUCTURES USING A SIMPLE LOW-TEMPERATURE ELECTROLESS PLATING PROCESS

The application of electroless plating as a simple low-temperature dep osition process for selective patterning of Ni films on silicon wafer to produce Ni micromechanical structures is presented. Ni structures a re formed by catalytic reduction of Ni++ ions in solution. The pattern ed films are resistant to anisotropic silicon etchants, making the str uctures suitable for subsequent maskless silicon micromachining to pro duce Ni micromechanical structures. Ni Purity as high as 99.5% is rout inely achieved using this process. Simplicity of electroless plating a nd the relatively few masking steps make this technique attractive for the production of Ni micromechanical structures for sensors and actua tors (transducers) fabrication.