Electron beam lithography (EBL) With a low accelerating voltage (appro
ximately 2 kV) was utilized for the fabrication of nanostructures. A r
esolution of 30 nm was achieved for both sparse and dense lines. The h
igh resolution resulted from the low aberrations of the electron optic
s system of the field emission scanning electron microscope used as an
EBL machine and from the preferred small-angle forward scattering cha
racteristic of the low-energy exposing electrons. By comparison with 5
0 kV EBL, we show a large reduction in the proximity effect and demons
trate a 60 nm spacing between two large exposed areas. Moreover, it is
shown that the critical dose at 2 kV is more than an order of magnitu
de less than that at 50 kV exposures.