The structural properties of epoxy can be retained and thermal stabili
ty improved by blending epoxy with bismaleimide (BMI) and curing them
simultaneously. Depending on the curing agent, the overall viscoelasti
c properties of the cured material can be varied. In the present work,
diaminodiphenylmethane and diaminodiphenyl sulfone have been used as
curing agents to prepare blends of epoxy and BMI. The blends were char
acterized by DSC, TG, DMA, and SEM. Results indicate that an excellent
interpenetrating network forms in both the cases and that the DDM-cur
ed system gives better thermal stability than that of the DDS-cured sy
stem. (C) 1993 John Wiley & Sons, Inc.