A. Agarwal et al., OXYGEN GETTERING AND PRECIPITATION AT MEV SI-IMPLANTATION INDUCED DAMAGE IN SILICON( ION), Applied physics letters, 69(25), 1996, pp. 3899-3901
interaction of intrinsic oxygen in Czhochralski silicon with implantat
ion damage induced by 2.0 MeV Si+ ions has been investigated as a func
tion of annealing temperature and time. Four distinct regions of oxyge
n localization are revealed by secondary ion mass spectrometry followi
ng sample annealing. The different regions are correlated with either
a near surface vacancy-rich region or the buried layer of extended def
ects near the projected range. The relative concentration of oxygen in
each region depends on the competition between oxygen gettering in ea
ch region and out-diffusion to the surface. It has been established, u
sing quasikinematical and dynamical contrast transmission electron mic
roscopy imaging techniques, that the oxygen in regions containing exte
nded dislocations is in the form of fine precipitates. The precipitate
s decorate both the dislocations and, for faulted loops, the stacking
fault planes. (C) 1996 American Institute of Physics.