Rw. Cook et Da. Tod, A STUDY OF THE CURE OF ADHESIVES USING DYNAMIC-MECHANICAL ANALYSIS, International journal of adhesion and adhesives, 13(3), 1993, pp. 157-162
Adhesives are being used extensively in fabrication as they offer many
advantages over standard joining methods. As the adhesive forms an in
tegral part of the structure, it is necessary to fully understand the
initial mechanical properties of the material and how these change wit
h ageing. Formal testing of materials often involves a considerable nu
mber of tensile tests. These are not only expensive but time consuming
. One method of speeding up the process is to study the small strain m
echanical properties of materials and therefore avoid the statistical
uncertainty involved in fracture tests. The aim of this paper is to sh
ow how the technique of dynamic mechanical spectrometry can be applied
to the study of adhesives and adhesive joints.