Ca. Musca et al., MOCVD-GROWN WIDER-BANDGAP CAPPING LAYERS IN HG1-XCDXTE LONG-WAVELENGTH INFRARED PHOTOCONDUCTORS, Semiconductor science and technology, 11(12), 1996, pp. 1912-1922
The use of MOCVD-grown wider-bandgap Hg1-xCdxTe as a capping layer for
long-wavelength infrared (LWIR) Hg1-xCdxTe photoconductors has been s
tudied using both theoretical and experimental results. A device model
is derived which shows that in the presence of a suitable energy barr
ier between the Hg1-xCdxTe infrared absorbing layer and the overlaying
passivation layer, the high surface recombination rate which is usual
ly present at the semiconductor/passivant interface is prevented from
having a significant effect on device performance. The energy barrier,
which repels photogenerated minority carriers from the semiconductor
surface, is introduced by employing an n-type Hg1-xCdxTe wafer which c
onsists of a wider-bandgap capping layer that is grown in situ by MOCV
D on an LWIR absorbing layer. The derived model allows the responsivit
y to be calculated by taking into account surface recombination at bot
h the front and back interfaces, thickness of capping and absorbing la
yers, recombination at the heterointerface, and variations in equilibr
ium electron concentration. Calculations show that for an x = 0.22 Hg(
1-x)C(d)xTe absorbing layer, the optimum capping layer consists of x g
reater than or equal to 0.25 and a thickness of the order of 0.1 to 0.
2 mu m. Experimental results are presented for x = 0.22 n-type Hg1-xCd
xTe conventional single-layer LWIR photoconductors, and for heterostru
cture photoconductors consisting of an LWIR absorbing layer of x = 0.2
2 capped by an n-type layer of x = 0.31. The model is used to extract
the recombination velocities at the heterointerface and the semiconduc
tor/substrate interface, which are determined to be 250 cm s(-1) and 1
00 cm s(-1) respectively. The experimental data clearly indicate that
the use of a heterostructure barrier between the overlaying passivatio
n layer and the underlying LWIR absorbing layer produces detectors tha
t exhibit much higher performance and are insensitive to the condition
of the semiconductor/passivant interface.