THE RESIDUAL THERMAL-STRESSES DUE TO COOL-DOWN OF POST CURE FOR THE SYMMETRICAL CROSS-PLY TCM COMPOSITE-MATERIAL

Citation
Rs. Chen et al., THE RESIDUAL THERMAL-STRESSES DUE TO COOL-DOWN OF POST CURE FOR THE SYMMETRICAL CROSS-PLY TCM COMPOSITE-MATERIAL, Composite structures, 26(3-4), 1993, pp. 155-166
Citations number
14
Categorie Soggetti
Material Science
Journal title
ISSN journal
02638223
Volume
26
Issue
3-4
Year of publication
1993
Pages
155 - 166
Database
ISI
SICI code
0263-8223(1993)26:3-4<155:TRTDTC>2.0.ZU;2-G
Abstract
This paper attempts to analyze the residual stress resulting from the effect of temperature during the cooling process of the symmetric cros s-ply composite laminate in post cure. In the analysis, the mechanical properties of the composite are determined in terms of the behavior o f the power law and TCM characteristic in the thermo-viscoelastic resp onse. Meanwhile, the coefficient of thermal expansion is assumed to be temperature-dependent and incorporated in this model. The Method of C alculus of Variation is then applied to derive the governing equations of the optimal temperature path.which ensures the minimum residual th ermal stress. In the numerical analysis, the successive iteration meth od is applied for these integro-differential equations.