This paper presents some possibilities for the use lignin/epoxy resins
in blends and composites with epoxy resins. A compatibility study was
carried out by optical and electron microscopy, viscosimetric determi
nations and thermo-optical analysis in order to establish optimum synt
hesis conditions of molding mass (cast resins). Lignin/epoxy composite
s including various fillers (lead soap, alum earth, talc, chalk, sand,
trihydrate aluminium oxide, glass fibers), palsticizer (dibutylphthal
ate and polyester C6) and pigments (iron-oxide and titanium dioxide) h
ave been obtained. Lignin/epoxy composites are characterized by good d
ielectric, mechanical and adhesive properties. These composite materia
ls can be used in the electronics industry.