Printed Circuit Board design and manufacturing technology is changing
rapidly in recent years. Major driving forces are developments of new
materials with improved characteristics, miniaturisation of components
with decreasing lead spacing and higher pin counts for LSI/VLSI, Surf
ace Mount Components (SMD), increasing board size to accommodate large
circuit and to reduce the interfaces viz: Connectors, Cables etc. The
resultant PCB products are double sided plated through hole boards wi
th tracks and spaces of 4 mils and less, Multilayer boards with high d
ensity of buried and blind vias, composite boards with separate layers
for signal, power and ground planes. The new board materials are need
ed to improve thermal mismatch with components as well as inner board
layers, thermal conductivity, structural strength against vibration an
d shock besides environmental consideration viz: humidity, thermal cyc
ling, high temperature etc. The application at high frequencies, with
high signal speed and the need to reduce cross talk interferences, ele
ctromagnetic interference also demand new design consideration besides
control on materials and process parameters. The present report focus
es on the development of PCB industry in India and attempts a medium t
erm market forecast. Trends in PCB materials, PCB design and related p
rocess technologies are discussed in brief. International market of PC
B and production (and market in various countries) have been indicated
. These data provides glimpses of qualitative growth parameters of PCB
market. Indian scene of PCBs has been presented giving details of ins
talled capacity, investments, production and exports. Based on the ava
ilable VIII Plan projections for the equipment sector, future demand o
f PCBs have been worked out. Technical capabilities alongwith efforts
to promote and upgrade this sector has been highlighted. Problems face
d by Indian PCB industry have been identified and few suggestions made
to remain competitive in international market.