CHEMICAL MICROANALYSIS OF SEMICONDUCTOR HETEROSTRUCTURES BY THICKNESSFRINGE IMAGING

Citation
Rw. Glaisher et Djh. Cockayne, CHEMICAL MICROANALYSIS OF SEMICONDUCTOR HETEROSTRUCTURES BY THICKNESSFRINGE IMAGING, Micron, 24(3), 1993, pp. 257-264
Citations number
16
Categorie Soggetti
Microscopy
Journal title
MicronACNP
ISSN journal
09684328
Volume
24
Issue
3
Year of publication
1993
Pages
257 - 264
Database
ISI
SICI code
0968-4328(1993)24:3<257:CMOSHB>2.0.ZU;2-U
Abstract
Thickness fringes observed in [100] bright field images of 90-degrees wedge specimens of semiconductor heterostructures are sensitive to cry stal chemistry. Following extensive experience in the recording and in terpretation of such images for the purpose of chemical microanalysis, we report on the following topics: (i) a reliable procedure for prepa ring 90-degrees wedge specimens by cleaving; (ii) a theoretical analys is of fine structure associated with the thickness fringe profiles and an assessment of its chemical sensitivity; and (iii) analysis of expe rimental thickness fringe profiles, recorded from a set of AlxGa1-xAs structures whose composition had previously been determined by X-ray r ocking curve methods. By comparing calculated thickness profiles with experimental images recorded with a solid state slow scan CCD camera, it is estimated that the Al x-fraction can be measured to an accuracy of 0.02 over the composition range 0.3 < x < 0.6.