ULTRASONIC C-SCAN IMAGING FOR MATERIAL CHARACTERIZATION

Advances in the field have enabled ultrasonic C-scan imaging to go bey ond its classical application of detecting large single flaws to meet the challenge of non-destructive evaluation for modern engineered stru ctures and new materials. Increased frequency of operation and novel t ransducer designs have led to micrometre resolution limits for both su rface and subsurface imaging. Improved image processing and analysis m ethods allow more information to be extracted from the classical and c ontemporary application of the C-scan technique. Important results and developments are discussed with references made to industrial applica tions.