Ion implanted planar p-n junctions are important for silicon carbide d
iscrete devices and integrated circuits. Conversion to p-type of n-typ
e 6H-SiC was observed for the first time using boron implantation. Dio
des were fabricated with boron implants at 25 and 1000-degrees-C, foll
owed by 1300-degrees-C post-implant annealing in a furnace. The best d
iodes measured at 21-degrees-C exhibited an ideality factor of 1.77, r
everse bias leakage of 10(-10) A/cm2 at -10 V, and a record high (for
a SiC-implanted diode) breakdown voltage of -650 V.