DEVELOPMENT OF NOVEL ARCHITECTURE AND ASSEMBLY TECHNIQUES FOR A DETECTOR UNIT FOR A SILICON MICRO-VERTEX DETECTOR USING THE FLIP-CHIP BONDING METHOD

We built full-size models of a detector unit for a silicon micro-verte x detector for the KEK B factory. The model consists of four dummy dou ble-sided, double-metal silicon micro-strip detectors and two silicon end boards with dummy readout VLSIs mounted on both sides. In this tri al the Flip-Chip Bonding (FCB) method, using an anisotropic conductive film, is applied to both sides of the detector unit to bond 640 strip s at a pitch of 50 gm. The structure using the FCB method successfully provides a new architecture for the detector unit of a vertex detecto r.