A design for a distributed free-space optical system is presented that
provides interconnection of electronic processing elements at the boa
rd level of packaging. The system can be expanded to more than two boa
rds and transfers an array of data in parallel between connection plan
es. The design uses binary optic microlens arrays to collimate and col
lect light from surface-emitting lasers, and it uses substrate-mode ho
lographic window elements for directing light to and from the bus regi
on. The use of a collection lens array for extending the alignment tol
erance of the imaging system is also discussed. The paper concludes wi
th experimental demonstrations of critical system components and perfo
rmance with 64-bit data arrays.